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中文
Bondability of gold wire on Ag plated Cu lead frame
XIAO Yuchen, WU Baoan, TANG Huiyi, LUAN Baifeng, TAN Xiaohong,
Jorunal of Functional Materials . 2023, (
1
): 1138 -1143 . DOI: 10.3969/j.issn.1001-9731.2023.01.020
