Bondability of gold wire on Ag plated Cu lead frame

doi:10.3969/j.issn.1001-9731.2023.01.020

Journal of Functional Materials ›› 2023, Vol. 54 ›› Issue (1) : 1138-1143. DOI: 10.3969/j.issn.1001-9731.2023.01.020

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Bondability of gold wire on Ag plated Cu lead frame

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2023, 54(1): 1138-1143 https://doi.org/10.3969/j.issn.1001-9731.2023.01.020

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Received	Revised	Published
2022-06-13	2022-09-21	2023-02-03
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2023-02-03

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