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中文
Research progress of high thermal conductivity diamond copper composites
PENG Zhuohao, WANG Zongyuan, WANG Jie, QIN Yun, JI Siyuan, WAN Weicai
Journal of Functional Materials . 2021, (
10
): 10075 -10082 . DOI: 10.3969/j.issn.1001-9731.2021.10.010
