Research progress of high thermal conductivity diamond copper composites

doi:10.3969/j.issn.1001-9731.2021.10.010

Jorunal of Functional Materials ›› 2021, Vol. 52 ›› Issue (10) : 10075-10082. DOI: 10.3969/j.issn.1001-9731.2021.10.010

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Research progress of high thermal conductivity diamond copper composites

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2021, 52(10): 10075-10082 https://doi.org/10.3969/j.issn.1001-9731.2021.10.010

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Received	Revised	Published
2021-06-03	2021-07-20	2021-10-30
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2021-10-30

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