The effect of C content on microstructure, hardness and resistivity of interstitial solid solution Cu-C thin films
FU Yanpeng1, SHANG Hailong2, MA Bingyang2, LI Rongbin1, 2, 3, RAN zhun3
Journal of Functional Materials . 2020, (6): 6091 -6095 .  DOI: 10.3969/j.issn.1001-9731.2020.06.015