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中文
The effect of C content on microstructure, hardness and resistivity of interstitial solid solution Cu-C thin films
FU Yanpeng
1
, SHANG Hailong
2
, MA Bingyang
2
, LI Rongbin
1, 2, 3
, RAN zhun
3
Journal of Functional Materials . 2020, (
6
): 6091 -6095 . DOI: 10.3969/j.issn.1001-9731.2020.06.015