The effect of C content on microstructure, hardness and resistivity of interstitial solid solution Cu-C thin films

doi:10.3969/j.issn.1001-9731.2020.06.015

Journal of Functional Materials ›› 2020, Vol. 51 ›› Issue (6) : 6091-6095. DOI: 10.3969/j.issn.1001-9731.2020.06.015

Research & Development

The effect of C content on microstructure, hardness and resistivity of interstitial solid solution Cu-C thin films

{{article.zuoZhe_EN}}

Author information +

History +

HeighLight

Abstract

Key words

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations

{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2020, 51(6): 6091-6095 https://doi.org/10.3969/j.issn.1001-9731.2020.06.015

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

Funding

RIGHTS & PERMISSIONS

PDF(4029 KB)

Accesses

Citation

Detail

Sections

Recommended

Received	Revised	Published
2020-01-11	2020-02-26	2020-06-30
Issue Date
2020-06-30

Please choose a citation manager

Content to export

HeighLight

Abstract

Key words

Cite this article

{{custom_sec.title}}

{{custom_sec.title}}

References

References

{{custom_fnGroup.title_en}}

Footnotes

{{custom_ack.title_en}}

Funding

RIGHTS & PERMISSIONS