The effect of C content on microstructure, hardness and resistivity of interstitial solid solution Cu-C thin films

doi:10.3969/j.issn.1001-9731.2020.06.015

Jorunal of Functional Materials ›› 2020, Vol. 51 ›› Issue (6) : 6091-6095. DOI: 10.3969/j.issn.1001-9731.2020.06.015

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The effect of C content on microstructure, hardness and resistivity of interstitial solid solution Cu-C thin films

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2020, 51(6): 6091-6095 https://doi.org/10.3969/j.issn.1001-9731.2020.06.015

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Received	Revised	Published
2020-01-11	2020-02-26	2020-06-30
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2020-06-30

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