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中文
Study on interfacial reaction of liquid Sn3.0Ag0.5Cu solder with Cu, Fe and Co substrate
LI Chao, HU Xiaowu, LI Yulong, JIANG Xiongxin
Journal of Functional Materials . 2018, (
2
): 2163 -2168 . DOI: 10.3969/j.issn.1001-9731.2018.02.028
