Study on interfacial reaction of liquid Sn3.0Ag0.5Cu solder with Cu, Fe and Co substrate

doi:10.3969/j.issn.1001-9731.2018.02.028

Journal of Functional Materials ›› 2018, Vol. 49 ›› Issue (2) : 2163-2168. DOI: 10.3969/j.issn.1001-9731.2018.02.028

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Study on interfacial reaction of liquid Sn3.0Ag0.5Cu solder with Cu, Fe and Co substrate

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2018, 49(2): 2163-2168 https://doi.org/10.3969/j.issn.1001-9731.2018.02.028

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2017-07-12	2018-02-28
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2018-02-28

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