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中文
Research progress on copper and silver bonding wires for microelectronic packaging technology
LIANG Shuang, HUANG Fuxiang, PENG Cheng, ZHONG Mingjun, WU Baoan, TANG Huiyi
Journal of Functional Materials . 2019, (
5
): 5048 -5053 . DOI: 10.3969/j.issn.1001-9731.2019.05.009
