Research progress on copper and silver bonding wires for microelectronic packaging technology

doi:10.3969/j.issn.1001-9731.2019.05.009

Journal of Functional Materials ›› 2019, Vol. 50 ›› Issue (5) : 5048-5053. DOI: 10.3969/j.issn.1001-9731.2019.05.009

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Research progress on copper and silver bonding wires for microelectronic packaging technology

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2019, 50(5): 5048-5053 https://doi.org/10.3969/j.issn.1001-9731.2019.05.009

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2018-12-21	2019-05-30
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2019-05-30

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