Research progress on copper and silver bonding wires for microelectronic packaging technology

doi:10.3969/j.issn.1001-9731.2019.05.009

Jorunal of Functional Materials ›› 2019, Vol. 50 ›› Issue (5) : 5048-5053. DOI: 10.3969/j.issn.1001-9731.2019.05.009

Review & Advance

Research progress on copper and silver bonding wires for microelectronic packaging technology

{{article.zuoZhe_EN}}

Author information +

History +

HeighLight

Abstract

Key words

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations

{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2019, 50(5): 5048-5053 https://doi.org/10.3969/j.issn.1001-9731.2019.05.009

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

Funding

RIGHTS & PERMISSIONS

PDF(1610 KB)

Accesses

Citation

Detail

Sections

Recommended

Received	Published
2018-12-21	2019-05-30
Issue Date
2019-05-30

Please choose a citation manager

Content to export

HeighLight

Abstract

Key words

Cite this article

{{custom_sec.title}}

{{custom_sec.title}}

References

References

{{custom_fnGroup.title_en}}

Footnotes

{{custom_ack.title_en}}

Funding

RIGHTS & PERMISSIONS