×
模态框(Modal)标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框(Modal)标题
在这里添加一些文本
Close
×
Toggle navigation
Home
About
About Journal
Indexed In
Honor
Chronicle of Events
Editorial Board
This Editorial Board
Journal
Current Issue
Just Accepted
Archive
Most Read
Most Download
Most Cited
E-mail Alert
Author
Instruction
Template
Reference Documents
Copyright Agreement
Publishing Ethics
Advertisement
Subscription
Contact Us
中文
Microstructure and barrier performance of Ta/Ti-Al integrated film used as a barrier layer for Cu metallization
Guo-Qiang Ren;Jin-Zhu Xing;Xiao-Hong Li
. 2012, (
04
): 462 -464 .