Microstructure and barrier performance of Ta/Ti-Al integrated film used as a barrier layer for Cu metallization
Guo-Qiang Ren;Jin-Zhu Xing;Xiao-Hong Li
Microstructure and barrier performance of Ta/Ti-Al integrated film used as a barrier layer for Cu metallization
{{custom_ref.label}} |
{{custom_citation.content}}
{{custom_citation.annotation}}
|
/
〈 | 〉 |