×
模态框（Modal）标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框（Modal）标题
在这里添加一些文本
Close
×
Toggle navigation
Home
About
About Journal
Indexed In
Honor
Chronicle of Events
Editorial Board
This Editorial Board
Journal
Current Issue
Just Accepted
Archive
Most Read
Most Download
Most Cited
E-mail Alert
Author
Instruction
Template
Reference Documents
Copyright Agreement
Publishing Ethics
Advertisement
Subscription
Contact Us
中文
Study on the thermal conductivity of foam materials prepared from hollow microspheres
QU Yanan, MI Haihui, SU Zhenguo, XU Xingxing, LV Ruifang, LIU Pai, YANG Jinlong
Journal of Functional Materials . 2017, (
1
): 1073 -1077 . DOI: 10.3969/j.issn.1001-9731.2017.01.011
