Effect of process parameters on the microstructure and properties of copper film deposited by arc ion plating

Effect of process parameters on the microstructure and properties of copper film deposited by arc ion plating

Le-Le DENG;;Bo Hou;;

Journal of Functional Materials ›› 2015, Vol. 46 ›› Issue (07) : 1-0.

Effect of process parameters on the microstructure and properties of copper film deposited by arc ion plating

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