Effect of H2O2 on the planarization efficiency of the copper pattern wafer in the copper clearing step

Effect of H2O2 on the planarization efficiency of the copper pattern wafer in the copper clearing step

Yang Cao

Journal of Functional Materials ›› 2014, Vol. 45 ›› Issue (S1) : 34-0.

Effect of H2O2 on the planarization efficiency of the copper pattern wafer in the copper clearing step

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