Fabrication of low melting point In-Bi solder powders using liquidphase dispersion method and its low temperature soldering properties

doi:10.3969/j.issn.1001-9731.2020.07.019

Journal of Functional Materials ›› 2020, Vol. 51 ›› Issue (7) : 7117-7122. DOI: 10.3969/j.issn.1001-9731.2020.07.019

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2020, 51(7): 7117-7122 https://doi.org/10.3969/j.issn.1001-9731.2020.07.019

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2020-02-22	2020-07-30
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2020-07-30

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