Investigation on thermal expansion properties of a braided SiCf/SiCm composite considering fiber-matrix interface and porosity

NIU Hongwei, WEN Min, ZHANG shuai

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Jorunal of Functional Materials ›› 2020, Vol. 51 ›› Issue (4) : 4101-4108. DOI: 10.3969/j.issn.1001-9731.2020.04.017
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Investigation on thermal expansion properties of a braided SiCf/SiCm composite considering fiber-matrix interface and porosity

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2020, 51(4): 4101-4108 https://doi.org/10.3969/j.issn.1001-9731.2020.04.017

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