Oxygen-vacancy formation and packaging technology of β-SiC/SiOxCy/Cfree nanocomposite films as heat dissipation substrate

doi:10.3969/j.issn.1001-9731.2017.06.036

Jorunal of Functional Materials ›› 2017, Vol. 48 ›› Issue (6) : 6199-6202. DOI: 10.3969/j.issn.1001-9731.2017.06.036

Oxygen-vacancy formation and packaging technology of β-SiC/SiO_xC_y/C_free nanocomposite films as heat dissipation substrate

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2017, 48(6): 6199-6202 https://doi.org/10.3969/j.issn.1001-9731.2017.06.036

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2016-11-15	2017-06-28
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2017-06-28

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