Study on structure and properties of copper films deposited by DC pulsed magnetron sputtering

doi:10.3969/j.issn.1001-9731.2017.02.026

Journal of Functional Materials ›› 2017, Vol. 48 ›› Issue (2) : 2144-2148. DOI: 10.3969/j.issn.1001-9731.2017.02.026

Research & Development

Study on structure and properties of copper films deposited by DC pulsed magnetron sputtering

{{article.zuoZhe_EN}}

Author information +

History +

HeighLight

Abstract

Key words

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations

{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2017, 48(2): 2144-2148 https://doi.org/10.3969/j.issn.1001-9731.2017.02.026

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

Funding

RIGHTS & PERMISSIONS

PDF(3186 KB)

Accesses

Citation

Detail

Sections

Recommended

Received	Published
2016-03-10	2017-02-28
Issue Date
2017-02-28

Please choose a citation manager

Content to export

HeighLight

Abstract

Key words

Cite this article

{{custom_sec.title}}

{{custom_sec.title}}

References

References

{{custom_fnGroup.title_en}}

Footnotes

{{custom_ack.title_en}}

Funding

RIGHTS & PERMISSIONS