Studies on electroless plating Ni-P alloy film on Al substrate and electrical property of Al/Ni-P/Cu composite

doi:10.3969/j.issn.1001-9731.2016.增刊(Ⅰ).002

Journal of Functional Materials ›› 2016, Vol. 47 ›› Issue (S1) : 7-12. DOI: 10.3969/j.issn.1001-9731.2016.增刊(Ⅰ).002

Focuses& Concerns

Studies on electroless plating Ni-P alloy film on Al substrate and electrical property of Al/Ni-P/Cu composite

{{article.zuoZhe_EN}}

Author information +

History +

HeighLight

Abstract

Key words

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations

{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2016, 47(S1): 7-12 https://doi.org/10.3969/j.issn.1001-9731.2016.增刊(Ⅰ).002

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

Funding

RIGHTS & PERMISSIONS

PDF(5466 KB)

Accesses

Citation

Detail

Sections

Recommended

Received	Published
2015-10-05	2016-11-20
Issue Date
2016-11-20

Please choose a citation manager

Content to export

HeighLight

Abstract

Key words

Cite this article

{{custom_sec.title}}

{{custom_sec.title}}

References

References

{{custom_fnGroup.title_en}}

Footnotes

{{custom_ack.title_en}}

Funding

RIGHTS & PERMISSIONS