C含量对间隙固溶Cu-C薄膜微结构、硬度及电阻率的影响
付彦鹏, 尚海龙, 马冰洋, 李荣斌, 冉准
The effect of C content on microstructure, hardness and resistivity of interstitial solid solution Cu-C thin films
FU Yanpeng1, SHANG Hailong2, MA Bingyang2, LI Rongbin1, 2, 3, RAN zhun3
功能材料
.
2020, (6): 6091
-6095
.
DOI: 10.3969/j.issn.1001-9731.2020.06.015
