考虑界面层和孔隙的SiCf/SiCm复合材料热膨胀性能研究
牛宏伟, 文敏, 张帅
Investigation on thermal expansion properties of a braided SiCf/SiCm composite considering fiber-matrix interface and porosity
NIU Hongwei, WEN Min, ZHANG shuai
功能材料
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2020, (4): 4101
-4108
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DOI: 10.3969/j.issn.1001-9731.2020.04.017
