液态Sn3.0Ag0.5Cu钎料与Cu、Fe及Co基板界面反应研究
李超, 胡小武, 李玉龙, 江雄心
Study on interfacial reaction of liquid Sn3.0Ag0.5Cu solder with Cu, Fe and Co substrate
LI Chao, HU Xiaowu, LI Yulong, JIANG Xiongxin
功能材料
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2018, (2): 2163
-2168
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DOI: 10.3969/j.issn.1001-9731.2018.02.028
