无铅玻璃粘结相对铜导电浆料性能的影响
蒙青, 屈银虎, 成小乐, 刘新峰, 周宗团, 崔航兵
The effects of the lead-free glass powders on performances of copper electronic paste
MENG Qing, QU Yinhu, CHENG Xiaole, LIU Xinfeng, ZHOU Zongtuan, CUI Hangbing
功能材料
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2016, (2): 2130
-2134
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DOI: 10.3969/j.issn.1001-9731.2016.02.026
