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中文
Numerical simulation of diamond wafer diameter on the heat dissipation characteristics of composite heat sinks
LIU Ming, MAN Weidong, CHEN Keyu, LU Bifa, WANG Zilong
Journal of Functional Materials . 2026, (
2
): 27 -34 . DOI: 10.3969/j.issn.1001-9731.2026.02.004
