Numerical simulation of diamond wafer diameter on the heat dissipation characteristics of composite heat sinks

doi:10.3969/j.issn.1001-9731.2026.02.004

Journal of Functional Materials ›› 2026, Vol. 57 ›› Issue (2) : 27-34. DOI: 10.3969/j.issn.1001-9731.2026.02.004

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Numerical simulation of diamond wafer diameter on the heat dissipation characteristics of composite heat sinks

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2026, 57(2): 27-34 https://doi.org/10.3969/j.issn.1001-9731.2026.02.004

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Received	Revised	Published
2025-07-01	2025-07-26	2026-02-28
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2026-03-06

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