高导热金刚石/Cu复合材料研究进展
彭卓豪, 王宗元, 王杰, 秦运, 季思源, 万维财
Research progress of high thermal conductivity diamond copper composites
PENG Zhuohao, WANG Zongyuan, WANG Jie, QIN Yun, JI Siyuan, WAN Weicai
功能材料
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2021, (10): 10075
-10082
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DOI: 10.3969/j.issn.1001-9731.2021.10.010
