电子封装用铜及银键合丝研究进展
梁爽, 黄福祥, 彭成, 钟明君, 吴保安, 唐会毅
Research progress on copper and silver bonding wires for microelectronic packaging technology
LIANG Shuang, HUANG Fuxiang, PENG Cheng, ZHONG Mingjun, WU Baoan, TANG Huiyi
功能材料
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2019, (5): 5048
-5053
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DOI: 10.3969/j.issn.1001-9731.2019.05.009
