HWCVD工艺参数对a-Si:H薄膜结构及其对单晶硅片钝化效果的影响研究

何玉平

The structure and passivation effect for the c-Si wafer of a-Si:H films with different processing parameters by HWCVD

Yu-ping He

. 2015, (22): 24 -0 .