通过形变时效工艺同时提高Al-Mg-Si-Cu合金强度和电导率

陈敬, 陈江华, 刘春辉, 赖玉香, 顾媛

PDF(4109 KB)
功能材料 ›› 2016, Vol. 47 ›› Issue (2) : 2139-2142. DOI: 10.3969/j.issn.1001-9731.2016.02.028
研究·开发

通过形变时效工艺同时提高Al-Mg-Si-Cu合金强度和电导率

    {{javascript:window.custom_author_cn_index=0;}}
  • {{article.zuoZhe_CN}}
作者信息 +

Simultaneously improvingstrength and electrical conductivity in Al-Mg-Si-Cu alloy by combined deformation and aging

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

本文亮点

{{article.keyPoints_cn}}

HeighLight

{{article.keyPoints_en}}

摘要

{{article.zhaiyao_cn}}

Abstract

{{article.zhaiyao_en}}

关键词

Key words

引用本文

导出引用
{{article.zuoZheCn_L}}. {{article.title_cn}}. {{journal.qiKanMingCheng_CN}}. 2016, 47(2): 2139-2142 https://doi.org/10.3969/j.issn.1001-9731.2016.02.028
{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2016, 47(2): 2139-2142 https://doi.org/10.3969/j.issn.1001-9731.2016.02.028

参考文献

参考文献

{{article.reference}}

基金

版权

{{article.copyrightStatement_cn}}
{{article.copyrightLicense_cn}}
PDF(4109 KB)

Accesses

Citation

Detail

段落导航
相关文章

/