Development of high-temperature lead-free solder in electronic micro-connection

Development of high-temperature lead-free solder in electronic micro-connection

GAN Gui-sheng;DU Chang-hua;GAN Shu-de

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Journal of Functional Materials ›› 2013, Vol. 44 ›› Issue (S1) : 28-35.

Development of high-temperature lead-free solder in electronic micro-connection

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