Investigation review of the properties of intermetallic compounds in lead-free solder joint in electronic packaging

Investigation review of the properties of intermetallic compounds in lead-free solder joint in electronic packaging

ZHU Yong-xin;LI Xiao-yan;XIAO Hui

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Journal of Functional Materials ›› 2013, Vol. 44 ›› Issue (04) : 457-462.

Investigation review of the properties of intermetallic compounds in lead-free solder joint in electronic packaging

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