Investigation on the removal rate and planarization properties of an alkaline slurry for Cu CMP

Investigation on the removal rate and planarization properties of an alkaline slurry for Cu CMP

Xin-Liang TANG

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Journal of Functional Materials ›› 2012, Vol. 43 ›› Issue (20) : 13-0.

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Investigation on the removal rate and planarization properties of an alkaline slurry for Cu CMP

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