Microstructure and barrier performance of Ta/Ti-Al integrated film used as a barrier layer for Cu metallization

Microstructure and barrier performance of Ta/Ti-Al integrated film used as a barrier layer for Cu metallization

Guo-Qiang Ren;Jin-Zhu Xing;Xiao-Hong Li

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Journal of Functional Materials ›› 2012, Vol. 43 ›› Issue (04) : 462-464.

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Microstructure and barrier performance of Ta/Ti-Al integrated film used as a barrier layer for Cu metallization

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